材料/产品

INNOVATION THROUGH CONSILIENCE

有机半导体材料 (OSC)

核心竞争力：有机/无机材料的合成

Organic Thin Film Transistor InkSet

Formulation Selection Guideline

根据镀膜工艺、晶体管元件性能和应用，选择各种有机半导体材料

Formulation Coating Method Mobility
Spin Slot-die Inkjet Gravure
CP3100 ● ● ● ● 0.5 ~ 1.0
CP4100 ● ● ● ● 0.3 ~ 0.6
CP5100 ● ~ 4.0
CN5100 ● ● ● ● ~ 0.5

  • Planarization layer

    Planarization Layer A5XXX

  • Semiconductors p-types

    CP3100 Series
    ㆍEnable aSi replacement
    ㆍMobility up to 1㎠/Vs

    CP4100 Series
    ㆍMobility up to 1㎠/Vs
    ㆍCross-linkable semiconductor

    CP5100 Series
    ㆍMobility up to 4㎠/Vs

  • Semiconductors n-types

    CN5000 Series
    ㆍMobility up to 1.5㎠/Vs

  • Dielectrics

    CD2200 Series
    ㆍThermally cross linking dielectric

    CD7100 Series
    ㆍUV photopatternable dielectric

  • Ink Sets

    Inkset C1000SP
    ㆍBased on CP3100
    ㆍOptimized for spin coating

    Inkset C2000SL
    ㆍBased on CP5100
    ㆍOptimized for slot die or blade coating of OSC

    Inkset C3000S
    ㆍInkset for Metal Layer

  • Applications

    X-Ray Detector Fingerprint Sensor

    X-Ray Detector

    Display Backplanes OLED, Micro-LED

CP3100 Formulation Series

ㆍ适用于各种镀膜方法的有机p-type半导体材料
·具有均匀的元件特性与优秀的大气稳定性
·使用Non-halogenated溶剂配制墨
·可适用于Bottom-gate和Top-gate晶体管结构
·流动性 0.5~1 cm2/Vs
·On/Off ratio > 106
·a-Si元件性能可在低价材料中体现

Method Viscosity(mPas) Availability Applications
Spin-coating 1.0 – 2.0 ● EPD, LCD
(display backplane)
Logic Circuits, Sensors
(in logistics, packaging, …)
Slot-die coating 1.0 – 8.0 ●
Inkjet printing ●
Gravure printing ●
Stripe coating 0.5 – 3.0 ●
Flexographic printing ●

CN5100 Formulation Series

ㆍ具有优秀的有机半导体液体和元件的空气稳定性
·使用Non-halogenated溶剂配制墨
·可适用于Bottom-gate和Top-gate晶体管结构
ㆍ流动性 ~0.5 cm2/Vs
ㆍ所有工序都可以在PET基材上进行

Method Viscosity(mPas) Availability Applications
Spin-coating 0.5 – 1.5 ● EPD, LCD
(display backplane)
Logic Circuits, Sensors
(in logistics, packaging, …)
Slot-die coating 1.0 – 8.0 ●
Inkjet printing ●
Stripe coating 0.5 – 3.0 ●